DLIP Technology

DLIP

Direct Laser Interference Patterning (DLIP) is an advanced laser-structuring technology that uses the physical principle of interference - allowing precise and reliable surface functionalization for relevant applications .

How it works

Precision through interference.

DLIP is a science-based technology in laser-based surface structuring. It uses controlled interference of laser beams to functionalize surfaces at high speed and with exceptional precision. The laser beam is split into multiple partial beams and superimposed on the material surface. Where constructive interference occurs, a periodic intensity pattern is formed - the basis for microscopic structures in the sub-micrometer to micrometer range.

Functional Principle

The resulting interference pattern is projected directly onto the surface. With a single laser pulse, hundreds to thousands of identical structures are generated simultaneously - precise, homogeneous and with extraordinary depth of field.

The geometry of the pattern - such as lines, dots or grids - is determined by the number and arrangement of the overlapping beams. By selecting the appropriate laser wavelength (typically UV to NIR), the process can be optimized for any given material - metal, polymer, ceramic or glass.

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ELIPSYS® - The Operating System

The patented and propitiatory ELIPSYS® platform provides the leading, fastest and most precise implementation of DLIP available today as an operating system for programmable, functional metasurfaces. It enables the creation of periodic, functional surface structures at record speed - with industrially scalable throughput of several square meters per minute.

Learn more about ELIPSYS®

The Surface Revolution

DLIP represents the base technology base to a new generation of functional surfaces. It creates reproducible structures at unprecedented speed - physically precise, gentle on materials and fully scalable for industrial use. DLIP forms the foundation of the SurFunction platform - and the origin of a new era of programmable, functional metasurfaces.

Physical Principle

DLIP uses interference of two or more laser beams to generate a periodic intensity pattern on the surface. This pattern is transferred directly into the material - without masks, additives or chemical processing. Core parameters include the number of beams, the pattern geometry and structure sizes in the sub-micrometer range.

Process Characteristics

DLIP is a purely physical process with no deposition, masking or coating. It delivers highly reproducible results with exceptional depth of field and minimal thermal load. Material integrity remains fully preserved while achieving maximum precision and efficiency.

Material Diversity

DLIP works on virtually all material classes - metals, polymers, glasses and ceramics.
By tuning the laser wavelength from UV to NIR, the process is adapted precisely to the material’s absorption behavior.
This enables new design freedom for functional surfaces across multiple industries.

Functional Effects

DLIP imparts surfaces with durable, deterministic and precisely controllable properties.
It enables engineered effects such as reduced friction, antibacterial performance, anti-stick behavior, optical encoding and improved conductivity.
Light becomes a direct source of functional performance.

Expanding DLIP

Expanding Surface Functionality

XDLIP® can be combined with complementary thin film technologies to extend, refine or enhance effects - enabling integrated and synergistic solutions for functional metasurfaces.

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